The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 24, 2021

Filed:

Jul. 03, 2019
Applicant:

Semiconductor Components Industries, Llc, Phoenix, AZ (US);

Inventor:
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/3213 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
H01L 21/32134 (2013.01); H01L 21/02194 (2013.01); H01L 21/02628 (2013.01);
Abstract

An etched nickel plated substrate and related methods is disclosed. Specific implementations may include providing a dielectric layer, coupling a layer of copper with a first side of the dielectric layer, plating a first side of the layer of copper with a layer of nickel; forming a patterned layer on the layer of nickel, and spray etching the layer of nickel using an etchant. The method may include holding the etchant on the dielectric layer for a predetermined period of time, and while holding the etchant, etching substantially only the layer of nickel until the layer of nickel may be substantially coextensive with a perimeter of each of a plurality of traces in the layer of copper.


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