The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 24, 2021
Filed:
Sep. 21, 2017
Sekisui Chemical Co., Ltd., Osaka, JP;
Sayaka Wakioka, Osaka, JP;
Hidefumi Yasui, Kouka, JP;
Shuujirou Sadanaga, Kouka, JP;
Masahiro Itou, Osaka, JP;
Shike Sou, Osaka, JP;
Yuta Yamanaka, Kouka, JP;
SEKISUI CHEMICAL CO., LTD., Osaka, JP;
Abstract
There is provided a conductive material in which, even when a conductive material is left for a certain period of time, solder of conductive particles can be efficiently placed on an electrode, and, in addition, even if an electrode width and an inter-electrode width are narrow, occurrence of migration can be effectively suppressed, and generation of voids can be effectively suppressed. The conductive material according to the present invention contains a plurality of conductive particles in which an outer surface portion of a conductive portion comprises solder, a thermosetting compound, an acid anhydride thermosetting agent, and an organophosphorus compound.