The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 24, 2021

Filed:

Apr. 16, 2020
Applicant:

Coretronic Corporation, Hsin-Chu, TW;

Inventors:

Pi-Tsung Hsu, Hsin-Chu, TW;

Chi-Tang Hsieh, Hsin-Chu, TW;

Assignee:

Coretronic Corporation, Hsin-Chu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04N 9/31 (2006.01); G02B 26/00 (2006.01); G03B 21/20 (2006.01); C09K 11/02 (2006.01); H01L 33/50 (2010.01);
U.S. Cl.
CPC ...
G02B 26/008 (2013.01); C09K 11/02 (2013.01); G03B 21/2033 (2013.01); H04N 9/3114 (2013.01); H01L 33/505 (2013.01);
Abstract

A wavelength conversion module and a projection device are provided. The wavelength conversion module includes a substrate, a wavelength conversion layer and a thermal conductive adhesive layer. The wavelength conversion layer is located on the substrate. The thermal conductive adhesive layer is located between the wavelength conversion layer and the substrate. The thermal conductive adhesive layer includes a plurality of particles, the particles are distributed in the thermal conductive adhesive layer, and a particle concentration of the particles has a volume ratio greater than 0% and less than or equal to 80%.


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