The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 24, 2021

Filed:

Mar. 13, 2019
Applicant:

Dalian University of Technology, Liaoning, CN;

Inventors:

Zhenyu Zhang, Liaoning, CN;

Junfeng Cui, Liaoning, CN;

Dongdong Liu, Liaoning, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N 1/32 (2006.01); G01N 1/34 (2006.01); G01N 3/42 (2006.01); G01N 23/04 (2018.01);
U.S. Cl.
CPC ...
G01N 1/32 (2013.01); G01N 1/34 (2013.01); G01N 3/42 (2013.01); G01N 23/04 (2013.01); G01N 2223/418 (2013.01); G01N 2223/61 (2013.01); G01N 2223/646 (2013.01);
Abstract

A method of in-situ TEM nanoindentation for a damaged layer of silicon is disclosed. Wet etching and ion beam lithography are used for preparing a silicon wedge sample. An etched silicon wedge is thinned and trimmed by a focused ion beam; thinning uses ion beam of 30 kV: 50-80 nA, and trimming uses ion beam of 5 kV: 1-6 pA; and the top width of the silicon wedge is 80-100 nm. The sample is fixed on a sample holder of an in-situ TEM nanomechanical system by using a conductive silver adhesive. The sample is indented with a tip in the TEM, so that the thickness of the damaged layer of the sample is 2-200 nm; and an in-situ nanoindentation experiment is conducted on the damaged layer of the sample in the TEM.


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