The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 24, 2021

Filed:

Sep. 10, 2019
Applicant:

National Tsing Hua University, Hsinchu, TW;

Inventors:

Chin-Wei Hsu, Hsinchu, TW;

Wei-Yen Wang, Hsinchu, TW;

Tzu-Chien Wei, Hsinchu, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 18/18 (2006.01); C23C 18/38 (2006.01); C23C 18/32 (2006.01); B01J 35/02 (2006.01); B01J 33/00 (2006.01); B01J 23/44 (2006.01); B01J 37/02 (2006.01); C23C 18/16 (2006.01);
U.S. Cl.
CPC ...
C23C 18/1893 (2013.01); B01J 23/44 (2013.01); B01J 33/00 (2013.01); B01J 35/023 (2013.01); C23C 18/1639 (2013.01); C23C 18/32 (2013.01); C23C 18/38 (2013.01);
Abstract

A method for electroless metal deposition and an electroless metal layer included substrate are provided. The method for electroless metal deposition includes steps as follows. a) cleaning a substrate, applying a hydrofluoric acid onto the substrate; and then applying a modifying agent onto the substrate to form a chemical oxide layer on the substrate; b) a catalyst layer is formed on the chemical oxide layer, wherein, the catalyst layer includes a plurality of colloidal nanoparticles, and each of the plurality of colloidal nanoparticles includes a palladium nanoparticle and a polymer which encapsulates the palladium nanoparticle, and c) depositing a metal on the catalyst layer through an electroless metal deposition to form an electroless metal layer.


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