The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 24, 2021

Filed:

Jul. 27, 2017
Applicant:

Sumitomo Chemical Company, Limited, Tokyo, JP;

Inventors:

Kohei Ueda, Ichihara, JP;

Koji Ishiwata, Osaka, JP;

Yasutoyo Kawashima, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09K 5/06 (2006.01); C08L 23/08 (2006.01); C08L 101/12 (2006.01); C08K 5/00 (2006.01);
U.S. Cl.
CPC ...
C09K 5/063 (2013.01); C08K 5/00 (2013.01); C08L 23/0869 (2013.01); C08L 101/12 (2013.01); C08L 2203/14 (2013.01); C08L 2207/32 (2013.01);
Abstract

A resin composition contains a polymer whose enthalpy of fusion (ΔH) observed within a temperature range of 10° C. or higher and lower than 60° C. in differential scanning calorimetry is 30 J/g or more; and a low-molecular-weight compound whose enthalpy of fusion (ΔH) observed within a temperature range of 0° C. or higher and lower than 100° C. in differential scanning calorimetry is 30 J/g or more and whose molecular weight is 2000 or lower. A content of the low-molecular-weight compound is 3 parts by weight to 1000 parts by weight with respect to 100 parts by weight of the total amount of polymer components contained in the resin composition except the low-molecular-weight compound.


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