The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 24, 2021

Filed:

Jul. 19, 2017
Applicant:

Denka Company Limited, Tokyo, JP;

Inventors:

Makiko Sasaki, Shibukawa, JP;

Takako Hoshino, Tokyo, JP;

Gosuke Nakajima, Shibukawa, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 4/00 (2006.01); B32B 7/12 (2006.01); B32B 27/20 (2006.01); B32B 27/34 (2006.01); B32B 27/30 (2006.01); C09J 4/06 (2006.01);
U.S. Cl.
CPC ...
C09J 4/00 (2013.01); B32B 7/12 (2013.01); B32B 27/20 (2013.01); B32B 27/30 (2013.01); B32B 27/34 (2013.01); C09J 4/06 (2013.01);
Abstract

Provided is an adhesive composition having high adhesiveness to polyamides. An adhesive composition for bonding adherends comprising a polyamide, comprising the following components (1) to (4): (meth)acrylates (1), excluding the component (2), comprising the following ingredients (1-1), (1-2), and (1-3): a (meth)acrylate (1-1), excluding an ingredient (1-3), having an aromatic group; a (meth)acrylate (1-2) having a hydroxy group; and a (meth)acrylate (1-3) represented by general formula (A); an acidic phosphate compound (2); a polymerization initiator (3); and a reducing agent (4) comprising a transition metal salt.


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