The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 24, 2021

Filed:

Nov. 24, 2017
Applicant:

Hoya Corporation, Tokyo, JP;

Inventors:

Hiroki Nakagawa, Akashi, JP;

Kashio Nakayama, Hokuto, JP;

Assignee:

HOYA CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09G 1/02 (2006.01); B24B 1/00 (2006.01); B81C 1/00 (2006.01); B24B 37/04 (2012.01); C09K 3/14 (2006.01); C23C 14/02 (2006.01); C23C 14/34 (2006.01); G11B 5/84 (2006.01);
U.S. Cl.
CPC ...
C09G 1/02 (2013.01); B24B 37/044 (2013.01); C09K 3/1454 (2013.01); C23C 14/028 (2013.01); C23C 14/34 (2013.01); G11B 5/8404 (2013.01);
Abstract

A method for polishing a glass substrate, by which a polishing speed that is higher than a conventional polishing speed can be maintained for a long period of time in processing for polishing a glass substrate using cerium oxide as polishing abrasive particles is provided. A polishing liquid containing cerium oxide as polishing abrasive particles is supplied to a polishing surface of a glass substrate, and the glass substrate is subjected to polishing processing. This polishing liquid contains the cerium oxide as polishing abrasive particles and a substance that reduces cerium oxide in response to light irradiation. Also, processing for irradiating the polishing liquid with light is performed when polishing processing is performed.


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