The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 24, 2021
Filed:
Jan. 19, 2018
Applicant:
Mitsubishi Gas Chemical Company, Inc., Tokyo, JP;
Inventors:
Yoshihiro Nakazumi, Tokyo, JP;
Kentaro Takano, Tokyo, JP;
Assignee:
MITSUBISHI GAS CHEMICAL COMPANY, INC., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 79/04 (2006.01); C08J 5/24 (2006.01); C08K 3/38 (2006.01); C08G 59/40 (2006.01); C08L 65/00 (2006.01); C08L 61/06 (2006.01); C08L 71/02 (2006.01); C08L 63/00 (2006.01); B32B 15/082 (2006.01); H05K 1/03 (2006.01); C08K 5/3415 (2006.01); C08L 61/14 (2006.01); C09D 163/00 (2006.01); B32B 15/08 (2006.01); B32B 27/42 (2006.01); C08G 59/68 (2006.01); C08G 73/06 (2006.01); B32B 27/20 (2006.01); C08K 5/315 (2006.01);
U.S. Cl.
CPC ...
C08L 79/04 (2013.01); B32B 15/08 (2013.01); B32B 15/082 (2013.01); B32B 27/20 (2013.01); B32B 27/42 (2013.01); C08G 59/4014 (2013.01); C08G 59/4042 (2013.01); C08G 59/686 (2013.01); C08G 73/065 (2013.01); C08J 5/24 (2013.01); C08K 3/38 (2013.01); C08K 5/3415 (2013.01); C08L 61/06 (2013.01); C08L 61/14 (2013.01); C08L 63/00 (2013.01); C08L 65/00 (2013.01); C08L 71/02 (2013.01); C09D 163/00 (2013.01); H05K 1/03 (2013.01); H05K 1/0373 (2013.01); B32B 2311/12 (2013.01); B32B 2311/24 (2013.01); B32B 2325/00 (2013.01); B32B 2361/00 (2013.01); B32B 2363/00 (2013.01); B32B 2371/00 (2013.01); B32B 2386/00 (2013.01); B32B 2457/08 (2013.01); C08G 2261/135 (2013.01); C08G 2261/3424 (2013.01); C08G 2261/45 (2013.01); C08G 2261/76 (2013.01); C08J 2379/04 (2013.01); C08J 2463/00 (2013.01); C08K 5/315 (2013.01); C08K 2003/385 (2013.01); C08L 2203/206 (2013.01);
Abstract
A resin composition according to the present invention contains a cyanate compound (A). Further, the resin composition according to the present invention contains a maleimide compound (B) and/or an epoxy resin (C); and primary hexagonal boron nitride particles (D) having an average aspect ratio of 4 to 10.