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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11097978 B1

PDFFull Text
Date of Patent:
Aug. 24, 2021

Filed:

Oct. 05, 2018

Bent substrate provided with print layer, and method for manufacturing same

Applicant:

Agc Inc., Chiyoda-ku, JP;

Inventors:

Junji Hori, Tokyo, JP;

Satoshi Mototani, Tokyo, JP;

Jun Ito, Tokyo, JP;

Assignee:

AGC INC., Chiyoda-ku, JP;

Attorney:

Oblon, McClelland, Maier & Neustadt, L.L.P.

Primary Examiner:

Zachary M Davis

Int. Cl.
CPC ...
B32B 3/02 (2006.01); C03C 17/00 (2006.01); B05D 1/02 (2006.01); C03C 17/22 (2006.01); C03C 17/28 (2006.01); B05D 1/32 (2006.01); B41M 1/12 (2006.01); B41M 1/40 (2006.01); B41M 5/00 (2006.01); B41M 7/00 (2006.01); B05D 3/02 (2006.01); B32B 3/28 (2006.01); B05D 3/06 (2006.01);
U.S. Cl.
CPC ...
C03C 17/002 (2013.01); B05D 1/02 (2013.01); B05D 1/327 (2013.01); C03C 17/22 (2013.01); C03C 17/28 (2013.01); B05D 3/0263 (2013.01); B05D 3/067 (2013.01); B32B 3/28 (2013.01); B41M 1/12 (2013.01); B41M 1/40 (2013.01); B41M 5/0011 (2013.01); B41M 5/0088 (2013.01); B41M 7/00 (2013.01); C03C 2218/112 (2013.01); C03C 2218/119 (2013.01); C03C 2218/32 (2013.01); C03C 2218/328 (2013.01); C03C 2218/34 (2013.01);
Abstract

A method for manufacturing a bent substrate, having a masking step of forming a masking member (M) on a bent substrate () and forming a predetermined pattern, and a printing step of forming a print layer (P) on a surface to be printed of the bent substrate () including the masking member (M). It is thereby possible to perform printing on a bent substrate having a curved surface part in a productive manner and at a high printing accuracy.

Find Patent Forward Citations

Quick Actions:

Hori, Junji. (2021). Bent substrate provided with print layer, and method for manufacturing same (U.S. Patent No. 11097978). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11097978

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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