The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 24, 2021
Filed:
Jun. 24, 2020
Applicant:
Rohm Co., Ltd., Kyoto, JP;
Inventors:
Goro Nakatani, Kyoto, JP;
Akira Fujita, Kyoto, JP;
Kazuya Nakakubo, Kyoto, JP;
Yasuhiro Fuwa, Kyoto, JP;
Assignee:
ROHM CO., LTD., Kyoto, JP;
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/335 (2006.01); B41J 2/34 (2006.01);
U.S. Cl.
CPC ...
B41J 2/3359 (2013.01); B41J 2/3354 (2013.01); B41J 2/3357 (2013.01); B41J 2/33515 (2013.01); B41J 2/33535 (2013.01); B41J 2/33545 (2013.01); B41J 2/33595 (2013.01); B41J 2/34 (2013.01);
Abstract
A thermal printhead includes a substrate, a protrusion formed on an obverse surface of the substrate and extending in a main scanning direction, a heat storage layer formed on a top surface of the protrusion, and a plurality of heat-generating parts arranged along the main scanning direction on the heat storage layer. The substrate and the protrusion are integrally formed from a single-crystal semiconductor.