The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 24, 2021
Filed:
Dec. 21, 2018
Hamilton Sundstrand Corporation, Charlotte, NC (US);
Tahany Ibrahim El-Wardany, Vernon, CT (US);
Joseph V. Mantese, Ellington, CT (US);
Abhijit Chakraborty, West Hartford, CT (US);
Paul Attridge, Colchester, CT (US);
Hamilton Sundstrand Corporation, Charlotte, NC (US);
Abstract
An additive manufacturing system includes an additive manufacturing (AM) device, a first sensor device, and a compute device. The AM device is configured to form a bulk component in a layer-by-layer manner, by at least iteratively depositing a first layer of raw material onto a working surface in a deposition chamber, consolidating the initial layer into an initial additive portion of the bulk component, then forming subsequent additive portions of the bulk component by depositing and consolidating a subsequent plurality of layers of the raw material onto the first additive portion. The first sensor device is configured to measure an actual composition of at least one first byproduct portion formed upon consolidation of one of the first or subsequent layers of raw material in the deposition chamber. The compute device includes a processor and a memory, and is communicatively coupled to the additive manufacturing device and first sensor device. The additive manufacturing device and compute device provide an in situ sensor analysis of the component while in a formation state during a build process by comparing an actual composition of the at least one first byproduct portion to an expected composition range stored in the memory.