The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 24, 2021
Filed:
Feb. 23, 2017
Toray Industries, Inc., Tokyo, JP;
Tetsuya Motohashi, Nagoya, JP;
Takafumi Hashimoto, Nagoya, JP;
Katsuhiro Miyoshi, Nagoya, JP;
Tamotsu Suzuki, Otsu, JP;
Yasumoto Noguchi, Otsu, JP;
Toray Industries, Inc., Tokyo, JP;
Abstract
A fiber-reinforced resin molding material containing at least bundled aggregates [A] of discontinuous reinforcing fibers and a matrix resin [M], wherein each of the bundled aggregates [A] is obtained by cutting a partially-separated fiber bundle, prepared by forming separation treatment sections separated into a plurality of bundles and non-separation treatment sections alternately along a lengthwise direction of a fiber bundle including a plurality of single fibers, at an angle θ (0°<θ<90°) with respect to the lengthwise direction of the fiber bundle.