The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 24, 2021

Filed:

Jun. 08, 2018
Applicant:

Oiles Corporation, Tokyo, JP;

Inventors:

Yasuhiro Shirasaka, Fujisawa, JP;

Masato Ono, Fujisawa, JP;

Assignee:

OILES CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B22F 7/04 (2006.01); C22C 1/04 (2006.01); C22C 19/03 (2006.01); C22C 30/04 (2006.01); C22C 33/02 (2006.01); C22C 38/00 (2006.01); C22C 38/08 (2006.01); B22F 9/08 (2006.01); F16C 33/12 (2006.01);
U.S. Cl.
CPC ...
B22F 7/04 (2013.01); B22F 9/082 (2013.01); C22C 1/0433 (2013.01); C22C 19/03 (2013.01); C22C 30/04 (2013.01); C22C 33/02 (2013.01); C22C 38/002 (2013.01); C22C 38/08 (2013.01); B22F 2301/15 (2013.01); B22F 2301/35 (2013.01); F16C 33/121 (2013.01); Y10T 428/12042 (2015.01);
Abstract

A manufacturing apparatushas a levelerwhich, while pulling out a steel plate starting with one end thereof and while transporting it, corrects the waviness and the like of the steel plate, which serves as a backing plateand is constituted by a continuous strip having a thickness of 0.3 to 2.0 mm and provided as a hoop material by being wound into a coil shape.


Find Patent Forward Citations

Shirasaka, Yasuhiro. (2021). Multilayered sintered plate and manufacturing method thereof (U.S. Patent No. 11097344). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11097344

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…