The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 17, 2021
Filed:
Sep. 12, 2019
Applicant:
International Business Machines Corporation, Armonk, NY (US);
Inventors:
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 3/02 (2006.01); H05K 3/40 (2006.01); H05K 3/28 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0298 (2013.01); H05K 1/0218 (2013.01); H05K 1/0231 (2013.01); H05K 1/111 (2013.01); H05K 1/115 (2013.01); H05K 1/181 (2013.01); H05K 3/02 (2013.01); H05K 3/28 (2013.01); H05K 3/40 (2013.01); H05K 2201/0715 (2013.01); H05K 2201/09672 (2013.01); H05K 2201/10015 (2013.01); H05K 2203/0723 (2013.01);
Abstract
A circuit board and method of manufacture therefor utilize voltage domain edge plating disposed on at least a portion of one or more edges of a circuit board to electrically couple voltage domain conductive shapes disposed in different conductive layers of the circuit board. By doing so, interconnection of multiple voltage domain conductive shapes in different conductive layers may be facilitated with improved power integrity, while also providing EMI shielding along the edge of the circuit board.