The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 17, 2021

Filed:

Jul. 27, 2018
Applicant:

Dura Operating, Llc, Auburn Hills, MI (US);

Inventors:

Michael Goatley, Ortonville, MI (US);

Brian Howe, Shelby Township, MI (US);

Assignee:

Other;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H02K 11/215 (2016.01); H02K 9/22 (2006.01); H05K 1/18 (2006.01); H05K 7/20 (2006.01); H02K 29/08 (2006.01); H02K 11/33 (2016.01);
U.S. Cl.
CPC ...
H05K 1/0203 (2013.01); H02K 9/22 (2013.01); H02K 11/215 (2016.01); H02K 29/08 (2013.01); H05K 1/181 (2013.01); H05K 7/209 (2013.01); H02K 11/33 (2016.01); H02K 2211/03 (2013.01); H05K 2201/066 (2013.01); H05K 2201/10151 (2013.01); H05K 2203/1316 (2013.01);
Abstract

A motor electronics unit includes a printed circuit board having a first side and a second side with electronic components connected to the printed circuit board. An electrical conductor is connected to the printed circuit board. A heat sink is connected to the printed circuit board. A pre-molded electrical connector shroud has a portion of the electrical conductor positioned within the electrical connector shroud. A housing has an endcap, both co-molded in a low pressure injection molding process of a thermally conductive polymeric material. The endcap encapsulates the printed circuit board including the electronic components connected to the printed circuit board and covers a first portion of the heat sink, with a second portion of the heat sink uncovered by the polymeric material of the endcap to permit heat transfer away from the printed circuit board. The endcap also encapsulates a portion of the electrical connector shroud.


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