The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 17, 2021

Filed:

Sep. 13, 2019
Applicant:

Honda Motor Co., Ltd., Tokyo, JP;

Inventors:

Tetsuya Sugano, Tochigi, JP;

Satoshi Oyama, Tochigi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01M 8/10 (2016.01); H01M 4/88 (2006.01); H01M 8/0245 (2016.01); H01M 8/1004 (2016.01); B29C 65/50 (2006.01); H01M 8/0234 (2016.01); H01M 8/1018 (2016.01);
U.S. Cl.
CPC ...
H01M 4/8807 (2013.01); B29C 65/50 (2013.01); H01M 4/8882 (2013.01); H01M 4/8896 (2013.01); H01M 8/0234 (2013.01); H01M 8/0245 (2013.01); H01M 8/1004 (2013.01); H01M 2008/1095 (2013.01);
Abstract

The processing apparatus includes: a first rolleraround which a gas-diffusion layer sheet (carbon paper CP) is wound, the gas-diffusion layer sheet being an electrically conductive porous member; a second rollerconfigured to take up the carbon paper CP wound around the first roller; and a processing oven configured to heat process a portion of the carbon paper CP, the portion having been fed from the first rollerbut not yet taken up by the second roller. A heat-resistant lead LE is provided, the heat-resistant lead LE having a length at least extending from the first rollerto the second rollerthrough the processing oven, being configured to be taken up by the second roller, and being bonded to the carbon paper CP impregnated with a thermosetting resin AD.


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