The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 17, 2021
Filed:
Aug. 25, 2017
Cree Huizhou Solid State Lighting Company Ltd., Guangdong, CN;
Chak Hau Charles Pang, Fanling, HK;
Yue Kwong Victor Lau, Laguna, HK;
JuZuo Sheng, Huizhou, CN;
Christopher P. Hussell, Cary, NC (US);
Cree Huizhou Solid State Lighting Company Limited, Huizhou, CN;
Abstract
Light emitting diode (LED) packages and LED displays utilizing the LED packages are disclosed. LED packages can have a plurality of cavities with each having one or more LEDs. The LEDs can be individually controllable so that the LED package emits the desired color combination of light from the package. The LED packages are arranged with an encapsulant over the cavities that shape the LED package emission to a wide angle or pitch. Some of the LED packages can have three cavities, while others can have four or more cavities. The packages can comprise an encapsulant that forms lenses over the cavities and continues beyond the cavities to cover surfaces of the LED package body. The body can include different anchoring features to improve package reliability by anchoring the encapsulant to the body. One embodiment of an LED display according to the present invention comprises a plurality of LED packages, at least some having a plurality of cavities. Each of the packages comprises a lens over each cavity to produce an emission of the LEDs that has a wider angle compared to the emission without the lens. A potting material can be included between adjacent ones of the LED packages and overlaps the package encapsulant to further improve reliability.