The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 17, 2021
Filed:
May. 08, 2020
Research & Business Foundation Sungkyunkwan University, Suwon-si, KR;
Seung Boo Jung, Seoul, KR;
Kyung Deuk Min, Suwon-si, KR;
Kwang Ho Jung, Suwon-si, KR;
Choong Jae Lee, Suwon-si, KR;
Hak San Jeong, Seoul, KR;
Jae Ha Kim, Seoul, KR;
Byeong Uk Hwang, Suwon-si, KR;
Research and Business Foundation Sungkyunkwan University, Suwon-si, KR;
Abstract
Disclosed is a method for transient liquid-phase bonding between metal materials using a magnetic force. In particular, in the method, a magnetic force is applied to a transient liquid-phase bonding process, thereby shortening a transient liquid-phase bonding time between the metal materials, and obtaining high bonding strength. To this end, an attractive magnetic force is applied to a ferromagnetic base while a repulsive magnetic force is applied to a diamagnetic base, thereby to accelerate diffusion. This may reduce a bonding time during a transient liquid-phase bonding process between two bases and suppress formation of Kirkendall voids and voids and suppress a layered structure of an intermetallic compound, thereby to increase a bonding strength.