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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11094661 B1

PDFFull Text
Date of Patent:
Aug. 17, 2021

Filed:

Nov. 15, 2016

Bonded structure and method of manufacturing the same

Applicant:

Kabushiki Kaisha Toyota Chuo Kenkyusho, Nagakute, JP;

Inventors:

Hirofumi Ito, Nagakute, JP;

Masanori Usui, Nagakute, JP;

Makoto Kuwahara, Nagakute, JP;

Assignee:

KABUSHIKI KAISHA TOYOTA CHUO KENKYUSHO, Nagakute, JP;

Attorney:

Oliff PLC

Primary Examiner:

Mary A Wilczewski

Assistant Examiner:

Tsz K Chiu

Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 21/52 (2006.01); B23K 20/00 (2006.01); H01L 23/48 (2006.01); B23K 1/00 (2006.01); B23K 35/26 (2006.01); B23K 35/30 (2006.01); H01L 23/373 (2006.01); B23K 101/40 (2006.01); B23K 103/08 (2006.01);
U.S. Cl.
CPC ...
H01L 24/29 (2013.01); B23K 1/0016 (2013.01); B23K 20/002 (2013.01); B23K 35/262 (2013.01); B23K 35/3033 (2013.01); H01L 21/52 (2013.01); H01L 23/3735 (2013.01); H01L 23/48 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); B23K 2101/40 (2018.08); B23K 2103/08 (2018.08); H01L 24/13 (2013.01); H01L 24/14 (2013.01); H01L 24/17 (2013.01); H01L 24/81 (2013.01); H01L 2224/04026 (2013.01); H01L 2224/05655 (2013.01); H01L 2224/08503 (2013.01); H01L 2224/13101 (2013.01); H01L 2224/1403 (2013.01); H01L 2224/2908 (2013.01); H01L 2224/2917 (2013.01); H01L 2224/2918 (2013.01); H01L 2224/29019 (2013.01); H01L 2224/29076 (2013.01); H01L 2224/29105 (2013.01); H01L 2224/29109 (2013.01); H01L 2224/29111 (2013.01); H01L 2224/29113 (2013.01); H01L 2224/29116 (2013.01); H01L 2224/29118 (2013.01); H01L 2224/29124 (2013.01); H01L 2224/29139 (2013.01); H01L 2224/29144 (2013.01); H01L 2224/29147 (2013.01); H01L 2224/29155 (2013.01); H01L 2224/29169 (2013.01); H01L 2224/29171 (2013.01); H01L 2224/29179 (2013.01); H01L 2224/29181 (2013.01); H01L 2224/29184 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/32503 (2013.01); H01L 2224/8121 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/83 (2013.01); H01L 2224/8321 (2013.01); H01L 2224/83065 (2013.01); H01L 2224/83075 (2013.01); H01L 2224/8381 (2013.01); H01L 2224/83097 (2013.01); H01L 2224/83201 (2013.01); H01L 2224/83825 (2013.01); H01L 2924/10272 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/35121 (2013.01);
Abstract

A highly reliable bonded structure having excellent thermal fatigue resistance characteristics and thermal stress relaxation characteristics is provided. The bonded structure of the present invention comprises a first member, a second member capable of being bonded to the first member, and a bonding part interposed between a first bond surface at the first member side and a second bond surface at the second member side to bond the first member and the second member. The bonding part has at least a bonding layer, a reinforcing layer, and an intermediate layer. The bonding layer is composed of an intermetallic compound and bonded to the first bond surface.

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