The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 17, 2021
Filed:
Aug. 06, 2019
Applicant:
Applied Materials, Inc., Santa Clara, CA (US);
Inventors:
Shuran Sheng, Saratoga, CA (US);
Lin Zhang, San Jose, CA (US);
Joseph C. Werner, Santa Clara, CA (US);
Assignee:
APPLIED MATERIALS, INC., Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01L 23/00 (2006.01); H01L 27/11582 (2017.01); C23C 16/50 (2006.01); C23C 16/26 (2006.01); C23C 14/10 (2006.01); C23C 14/06 (2006.01); C23C 16/40 (2006.01); C23C 16/34 (2006.01); C23C 14/35 (2006.01);
U.S. Cl.
CPC ...
H01L 23/562 (2013.01); C23C 14/0605 (2013.01); C23C 14/0652 (2013.01); C23C 14/10 (2013.01); C23C 14/35 (2013.01); C23C 16/26 (2013.01); C23C 16/345 (2013.01); C23C 16/402 (2013.01); C23C 16/50 (2013.01); H01L 21/0217 (2013.01); H01L 21/02115 (2013.01); H01L 21/02164 (2013.01); H01L 27/11582 (2013.01);
Abstract
A method and apparatus for forming a backside coating on a substrate to counteract stresses from a previously deposited film is disclosed. In one embodiment, a method for flattening a bowed substrate includes providing a substrate having a film stack formed on a first major surface thereof, wherein the substrate comprises a bowed orientation, and forming a coating a second major surface of the substrate, wherein the coating is configured to counter stresses produced by the film stack and flattens the substrate from the bowed orientation.