The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 17, 2021

Filed:

Nov. 11, 2019
Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventors:

Adrian Salinas, Garland, TX (US);

William Keith McDonald, Kemp, TX (US);

Scott Alexander Johannesmeyer, Richardson, TX (US);

Robert Paul Luckin, Plano, TX (US);

Stephen Arlon Meisner, Allen, TX (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/20 (2006.01); H01L 21/027 (2006.01); H01L 23/544 (2006.01);
U.S. Cl.
CPC ...
H01L 23/544 (2013.01); G03F 7/70125 (2013.01); H01L 21/0274 (2013.01); H01L 2223/5446 (2013.01);
Abstract

In examples, a method of manufacturing an integrated circuit comprises locating a photomask between a light source and a semiconductor wafer having a photoresist layer in a wafer scribe lane of the wafer, wherein the photomask comprises: a first mask scribe lane pattern; a second mask scribe lane pattern matching the first mask scribe lane pattern; and at least one circuit pattern of the integrated circuit located between the first and second mask scribe lane patterns. The method further includes illuminating the photomask to produce in the photoresist layer of the wafer scribe lane a first exposed portion corresponding to the second mask scribe lane pattern; locating the first mask scribe lane pattern between the light source and the first exposed portion; and illuminating the photomask, wherein the first mask scribe lane pattern substantially shields non-exposed portions of the photoresist layer of the wafer scribe lane from light exposure.


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