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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11094640 B1

PDFFull Text
Date of Patent:
Aug. 17, 2021

Filed:

Oct. 02, 2019

Package module

Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Sangkyu Lee, Suwon-si, KR;

Shanghoon Seo, Suwon-si, KR;

Jeongho Lee, Suwon-si, KR;

Assignee:

SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;

Attorney:

Sughrue Mion, PLLC

Primary Examiner:

Moazzam Hossain

Assistant Examiner:

Mohammad A Rahman

Int. Cl.
CPC ...
H01L 23/538 (2006.01); H01L 23/31 (2006.01); H01L 23/495 (2006.01); H01L 23/498 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2006.01); H01L 23/522 (2006.01); H01L 23/50 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5389 (2013.01); H01L 21/56 (2013.01); H01L 23/3128 (2013.01); H01L 23/49503 (2013.01); H01L 23/49816 (2013.01); H01L 23/50 (2013.01); H01L 23/5226 (2013.01); H01L 24/06 (2013.01); H01L 24/09 (2013.01); H01L 24/12 (2013.01); H01L 24/48 (2013.01); H01L 25/0657 (2013.01); H01L 2224/023 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/05008 (2013.01); H01L 2224/12105 (2013.01); H01L 2924/14 (2013.01); H01L 2924/15172 (2013.01); H01L 2924/15182 (2013.01);
Abstract

A package module includes a core structure including a frame having a penetrating portion, an electronic component disposed in the penetrating portion, and an insulating material covering at least a portion of each of the frame and the electronic component and filling at least a portion of the penetrating portion. The core structure further has a recessed portion in which a stopper layer is disposed on a bottom surface of the recessed portion. A semiconductor chip has a connection pad and is disposed in the recessed portion such that an inactive surface faces the stopper layer. An encapsulant covers at least a portion of each of the core structure and the semiconductor chip, and fills at least a portion of the recessed portion. An interconnect structure is disposed on the core structure and an active surface of the semiconductor chip, and includes a redistribution layer.

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