The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 17, 2021
Filed:
Oct. 31, 2019
Applicant:
Rohm Co., Ltd., Kyoto, JP;
Inventor:
Motoharu Haga, Kyoto, JP;
Assignee:
ROHM CO., LTD., Kyoto, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/58 (2006.01); H01L 21/66 (2006.01); H01L 21/78 (2006.01);
U.S. Cl.
CPC ...
H01L 22/30 (2013.01); H01L 21/78 (2013.01);
Abstract
A semiconductor element includes an element body and a test electrode. The element body has a principal surface facing in a thickness direction and a first side surface facing in a direction orthogonal to the principal surface and connected to the principal surface. The test electrode is disposed on the principal surface and is adjacent to the boundary between the principal surface and the first side surface. The element body is provided with a plurality of dents that straddle the boundary and are recessed from both the principal surface and the first side surface. The plurality of dents are arranged along the boundary.