The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 17, 2021
Filed:
Feb. 28, 2018
The Hong Kong University of Science and Technology, Hong Kong, CN;
Salahuddin Raju, Singapore, SG;
Man Sun John Chan, Hong Kong, CN;
Clarissa Cyrilla Prawoto, Hong Kong, CN;
The Hong Kong University of Science and Technology, Hong Kong, CN;
Abstract
Provided is an integrated circuit structure and a method for manufacturing the same. The integrated circuit structure comprises a substrate; a plurality of interconnecting structures on the substrate, each of the interconnecting structures comprises side surfaces and a top surface, the side surfaces directly define air gaps therebetween isolating the interconnecting structures from each other; and a planar protective layer on top of the plurality of interconnecting structures covering all of the air gaps. The protective layer comprises a sheltering film and a supporting film.