The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 17, 2021
Filed:
Jul. 19, 2019
Applicant:
Asm Ip Holding B.v., Almere, NL;
Inventors:
Delphine Longrie, Ghent, BE;
David Kurt de Roest, Kessel-Lo, BE;
Assignee:
ASM IP Holding B.V., Almere, NL;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/285 (2006.01); H01L 21/3065 (2006.01); H01L 21/28 (2006.01); H01L 21/3205 (2006.01); H01L 21/768 (2006.01); C23C 16/06 (2006.01); C23C 16/455 (2006.01); H01L 21/48 (2006.01); C23C 16/04 (2006.01); H01L 21/321 (2006.01); C23C 16/02 (2006.01); C23C 16/08 (2006.01);
U.S. Cl.
CPC ...
H01L 21/28562 (2013.01); C23C 16/0209 (2013.01); C23C 16/04 (2013.01); C23C 16/047 (2013.01); C23C 16/06 (2013.01); C23C 16/08 (2013.01); C23C 16/45527 (2013.01); H01L 21/28229 (2013.01); H01L 21/30655 (2013.01); H01L 21/321 (2013.01); H01L 21/32051 (2013.01); H01L 21/4846 (2013.01); H01L 21/76879 (2013.01);
Abstract
A method for selectively depositing a metallic film on a substrate comprising a first dielectric surface and a second metallic surface is disclosed. The method may include, exposing the substrate to a passivating agent, performing a surface treatment on the second metallic surface, and selectively depositing the metallic film on the first dielectric surface relative to the second metallic surface. Semiconductor device structures including a metallic film selectively deposited by the methods of the disclosure are also disclosed.