The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 17, 2021

Filed:

May. 19, 2017
Applicant:

Tanaka Kikinzoku Kogyo K.k., Tokyo, JP;

Inventors:

Takumi Niitsuma, Oshu, JP;

Yoshinori Aoyama, Hiratsuka, JP;

Junichi Takeuchi, Oshu, JP;

Ryuta Ido, Oshu, JP;

Hideya Takahashi, Oshu, JP;

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01H 11/04 (2006.01); B32B 15/20 (2006.01); C22C 5/06 (2006.01); C22C 9/06 (2006.01); C22F 1/08 (2006.01); H01H 1/04 (2006.01); C22C 9/00 (2006.01); C22C 21/00 (2006.01); C22C 30/02 (2006.01); C22C 5/08 (2006.01); C22F 1/14 (2006.01); B32B 15/01 (2006.01); H01H 1/023 (2006.01); H01H 1/025 (2006.01);
U.S. Cl.
CPC ...
H01H 11/041 (2013.01); B32B 15/018 (2013.01); B32B 15/20 (2013.01); C22C 5/06 (2013.01); C22C 5/08 (2013.01); C22C 9/00 (2013.01); C22C 9/06 (2013.01); C22C 21/00 (2013.01); C22C 30/02 (2013.01); C22F 1/08 (2013.01); C22F 1/14 (2013.01); H01H 1/023 (2013.01); H01H 1/025 (2013.01); H01H 1/04 (2013.01); H01H 11/04 (2013.01);
Abstract

The present invention is a clad material for an electric contact, including a base material composed of a Cu-based, precipitation-type age-hardening material, and a contact material composed of an Ag alloy bonded to the base material. On a bonded interface between the contact material and the base material, a width of a diffusion region including Ag and Cu is 2.0 μm or shorter. The clad material is produced by bonding each other the contact material and the base material having undergone solutionizing and age-hardening beforehand, suppressing the diffusion region from expanding after bonding. The present invention is capable of providing an electric contact, which achieves higher conductivity, without sacrificing property of the Cu-based, precipitation-type age-hardening material.


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