The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 17, 2021

Filed:

Nov. 30, 2017
Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;

Inventors:

Kang Wook Bong, Suwon-si, KR;

Byeong Cheol Moon, Suwon-si, KR;

Boum Seock Kim, Suwon-si, KR;

Jin Hyuk Jang, Suwon-si, KR;

Joung Gul Ryu, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01F 27/29 (2006.01); H01F 41/04 (2006.01); H01F 17/00 (2006.01); H01F 27/28 (2006.01); H01F 27/255 (2006.01); H01F 17/04 (2006.01);
U.S. Cl.
CPC ...
H01F 41/042 (2013.01); H01F 17/0006 (2013.01); H01F 17/0013 (2013.01); H01F 27/255 (2013.01); H01F 27/2804 (2013.01); H01F 27/29 (2013.01); H01F 27/292 (2013.01); H01F 41/046 (2013.01); H01F 41/043 (2013.01); H01F 2017/002 (2013.01); H01F 2017/0066 (2013.01); H01F 2017/048 (2013.01);
Abstract

A coil component includes a magnetic body and an external electrode disposed on an external surface of the magnetic body. The magnetic body includes a support member including a through hole, filled with a magnetic material, and a via hole, a coil disposed on at least one surface of the support member, and a magnetic material encapsulating the coil and the support member. A first conductive layer is disposed on a side surface of the via hole formed in the support member and the at least one surface of the support member. The via hole is filled with a portion of the second conductive layer disposed on the first conductive layer.


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