The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 17, 2021

Filed:

Jan. 25, 2019
Applicant:

Electrophotonic-ic Inc., Kanata, CA;

Inventors:

Gudmundur A. Hjartarson, Ottawa, CA;

Craig Elliott, Ottawa, CA;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/42 (2006.01); G02B 6/38 (2006.01); G02B 6/43 (2006.01); H04B 10/50 (2013.01); H04B 10/60 (2013.01); H04B 10/40 (2013.01);
U.S. Cl.
CPC ...
G02B 6/4292 (2013.01); G02B 6/3878 (2013.01); G02B 6/421 (2013.01); G02B 6/428 (2013.01); G02B 6/4249 (2013.01); G02B 6/4285 (2013.01); G02B 6/43 (2013.01); G02B 6/4228 (2013.01); G02B 6/4238 (2013.01); G02B 6/4245 (2013.01); G02B 6/4246 (2013.01); H04B 10/40 (2013.01); H04B 10/50 (2013.01); H04B 10/60 (2013.01);
Abstract

An electro-optical module is provided in the form of a Ceramic Ball Grid Array (CBGA) optical package with a detachable fiber optic connector. The electro-optical module is surface mountable on a printed circuit boards (PCB) using standard electronics pick-and-place and reflow manufacturing technology. A module housing array of ultra-high-speed single mode fiber based optical transmit and/or receive devices provides for high density fiber interconnections and can be mounted directly on a PCB in close proximity to associated electronics. The resulting shorter electrical interconnects reduce losses and distortion of the high frequency electrical signals enabling lower power signals and lower error rates on the interfaces, for applications such as high-speed data center interconnects. Shorter electrical interconnects may also allow for simpler clock and data recovery circuits or, in some cases, complete elimination of some of these circuits.


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