The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 17, 2021

Filed:

Nov. 29, 2017
Applicant:

Anheuser-busch Inbev S.a., Brussels, BE;

Inventors:

Daniel Peirsman, Leuven, BE;

Stijn Vandekerckhove, Leuven, BE;

Assignee:

Anheuser-Bush InBev S.A., Brussels, BE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F25D 19/00 (2006.01); B67D 1/00 (2006.01); B67D 1/08 (2006.01); F25D 31/00 (2006.01); F28F 5/00 (2006.01);
U.S. Cl.
CPC ...
F25D 19/006 (2013.01); B67D 1/0061 (2013.01); B67D 1/0861 (2013.01); B67D 1/0869 (2013.01); F25D 31/006 (2013.01); F28F 5/00 (2013.01); B67D 2210/00104 (2013.01); F25D 2331/802 (2013.01); F28F 2255/02 (2013.01); F28F 2255/04 (2013.01);
Abstract

A beverage container cooling unit has: (a) a housing having a slot for receiving a container therein, (b) a cooling element having a cold supply, (c) a heat conductive panel enabling heat transfer between a container provided in the slot and the cold supply; wherein the heat conductive panel has two material layers fixed against one another: (I) a first material layer defining a cooling surface facing the container receiving slot and an opposed surface, said first layer made of a material having a thermal expansion coefficient of X; (ii) a second material layer having a contact surface facing positioned against the opposed surface of the first material layer and a second opposed surface, the second material layer having a thermal expansion coefficient of X, different from X, the difference in thermal expansion causing the conductive panel to bulge at a change in temperature.


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