The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 17, 2021

Filed:

Oct. 31, 2017
Applicant:

Lg Chem, Ltd., Seoul, KR;

Inventors:

Hui Je Lee, Daejeon, KR;

Byung Su Park, Daejeon, KR;

Yoon Kyung Kwon, Daejeon, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 7/38 (2018.01); C09J 7/25 (2018.01); C09J 11/06 (2006.01); C09J 133/00 (2006.01); C08K 5/00 (2006.01); C08G 18/62 (2006.01); C09J 133/06 (2006.01); C09J 175/04 (2006.01); C09J 175/14 (2006.01); C08F 220/18 (2006.01); B32B 37/12 (2006.01); C08K 5/098 (2006.01);
U.S. Cl.
CPC ...
C09J 7/385 (2018.01); B32B 37/12 (2013.01); C08F 220/1808 (2020.02); C08G 18/6229 (2013.01); C08K 5/0091 (2013.01); C09J 7/255 (2018.01); C09J 11/06 (2013.01); C09J 133/00 (2013.01); C09J 133/066 (2013.01); C09J 175/04 (2013.01); C09J 175/14 (2013.01); B32B 2037/1253 (2013.01); C08G 2170/40 (2013.01); C08K 5/098 (2013.01); C09J 2301/408 (2020.08); C09J 2433/00 (2013.01); C09J 2467/006 (2013.01);
Abstract

The present application relates to a method for manufacturing a pressure-sensitive adhesive film. In an embodiment, a method for manufacturing a pressure-sensitive adhesive film having a pressure-sensitive adhesive layer and a base layer includes applying a pressure-sensitive adhesive composition on at least one side of a base layer, where the pressure-sensitive adhesive composition comprises an isocyanate compound, a metal compound and an acrylic polymer; and drying the pressure-sensitive adhesive composition at a temperature of 100° C. or higher to form a pressure-sensitive adhesive layer on the base layer.


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