The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 17, 2021
Filed:
Oct. 01, 2020
Admatechs Co., Ltd., Miyoshi, JP;
ADMATECHS., LTD., Miyoshi, JP;
Abstract
A filler for resinous composition is contained and used in resinous composition constituting electronic packaging material for electronic device, and includes: a filler ingredient including a crystalline siliceous material with a crystal structure made of at least one member selected from the group consisting of type FAU, type FER, type LTA, type MFI and type CHA, and/or type MWW, wherein: the filler ingredient is free of any activity when evaluated by an 'NH3-TPD' method; and includes the crystalline siliceous material in an amount falling in a range allowing the filler ingredient to exhibit a negative thermal expansion coefficient. The filler ingredient may further be free of a surface in which silver, copper, zinc, mercury, tin, lead, bismuth, cadmium, chromium, cobalt and nickel are exposed.