The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 17, 2021
Filed:
Jan. 09, 2018
Applicant:
Sumitomo Seika Chemicals Co., Ltd., Hyogo, JP;
Inventors:
Assignee:
SUMITOMO SEIKA CHEMICALS CO., LTD., Hyogo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 63/00 (2006.01); C09D 153/00 (2006.01); C09D 163/00 (2006.01); C09J 163/00 (2006.01); C08L 53/00 (2006.01); C09D 7/20 (2018.01); C08L 71/12 (2006.01); C09D 171/12 (2006.01); C09J 153/00 (2006.01); C09J 171/12 (2006.01); C09K 3/10 (2006.01); H01L 23/29 (2006.01); H05K 1/03 (2006.01); H05K 9/00 (2006.01);
U.S. Cl.
CPC ...
C08L 53/005 (2013.01); C08L 63/00 (2013.01); C08L 71/12 (2013.01); C09D 7/20 (2018.01); C09D 153/005 (2013.01); C09D 163/00 (2013.01); C09D 171/12 (2013.01); C09J 153/005 (2013.01); C09J 163/00 (2013.01); C09J 171/12 (2013.01); C09K 3/1018 (2013.01); H01L 23/296 (2013.01); H05K 1/0333 (2013.01); H05K 9/0081 (2013.01); C08L 2203/16 (2013.01); C08L 2203/20 (2013.01); C08L 2205/03 (2013.01); C09K 2200/0642 (2013.01); C09K 2200/0657 (2013.01); C09K 2200/0685 (2013.01); H05K 2201/0162 (2013.01);
Abstract
Provided is an epoxy resin composition having excellent adhesion and low dielectric characteristics. Specifically, provided is an epoxy resin composition comprising an acid-modified polyolefin resin and an epoxy resin having a specific structure.