The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 17, 2021

Filed:

Sep. 16, 2015
Applicant:

Smilesonica Inc., Edmonton, CA;

Inventors:

Cristian Scurtescu, Edmonton, CA;

Pascal Bisson, Edmonton, CA;

Assignee:

SMILESONICA INC., Edmonton, CA;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B32B 27/36 (2006.01); B32B 27/28 (2006.01); C09J 5/02 (2006.01); B32B 25/08 (2006.01); B32B 25/20 (2006.01); B32B 37/14 (2006.01);
U.S. Cl.
CPC ...
B32B 27/28 (2013.01); B32B 25/08 (2013.01); B32B 25/20 (2013.01); B32B 37/14 (2013.01); C09J 5/02 (2013.01); B32B 27/283 (2013.01); B32B 2250/24 (2013.01); B32B 2255/10 (2013.01); B32B 2255/205 (2013.01); B32B 2255/26 (2013.01); B32B 2255/28 (2013.01); B32B 2307/206 (2013.01); B32B 2307/50 (2013.01); B32B 2383/00 (2013.01); B32B 2535/00 (2013.01); C09J 2301/00 (2020.08); C09J 2301/12 (2020.08); C09J 2301/30 (2020.08); C09J 2301/40 (2020.08); C09J 2400/166 (2013.01); C09J 2400/226 (2013.01); C09J 2400/228 (2013.01); C09J 2421/006 (2013.01); C09J 2463/00 (2013.01); C09J 2465/008 (2013.01); C09J 2483/00 (2013.01); C09J 2483/003 (2013.01); Y10T 428/2843 (2015.01); Y10T 428/31663 (2015.04);
Abstract

Composite materials and methods of producing the same are provided. In some embodiments, the composite materials can comprise a polymer substrate, an intermediary material, such as a metal or oxide, mechanically attached onto the polymer substrate, and an elastomer bonded to the polymer substrate on the side of the polymer substrate comprising the intermediary materials. The elastomer can be bonded to the polymer substrate irreversibly, where the elastomer and the polymer substrate cannot be separated at their interface without breaking either the elastomer or the polymer substrate. In some embodiments, a primer and/or an epoxy can also be used. Uses of material sputtering or sputtered materials are also provided to bond a parylene substrate and silicone elastomer, or to enhance the relative strength of the bonding between the two. In addition, composite materials, and the use thereof, involving a parylene substrate, an elastomer receptacle, and liquid silicone are provided.


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