The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 17, 2021
Filed:
Oct. 20, 2014
Applicant:
United Technologies Corporation, Hartford, CT (US);
Inventors:
John D. Riehl, Hebron, CT (US);
Charles R. Watson, Windsor, CT (US);
Assignee:
RAYTHEON TECHNOLOGIES CORPORATION, Farmington, CT (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 70/48 (2006.01); B29B 13/02 (2006.01); B29B 13/00 (2006.01); B29C 33/10 (2006.01); B29K 79/00 (2006.01); B29L 9/00 (2006.01);
U.S. Cl.
CPC ...
B29C 70/48 (2013.01); B29B 13/00 (2013.01); B29B 13/023 (2013.01); B29C 33/10 (2013.01); B29B 2013/002 (2013.01); B29B 2013/005 (2013.01); B29K 2079/08 (2013.01); B29L 2009/00 (2013.01);
Abstract
A method of molding a component includes the steps of providing a plurality of fibers, applying the fibers with a low temperature sizing to form a plurality of sized fibers, forming a preform from the plurality of sized fibers, placing the preform in a mold, and de-sizing the preform by heating the mold to an initial temperature that is sufficient to break down the low temperature sizing to a gaseous phase. A molding apparatus is also disclosed.