The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 10, 2021
Filed:
Apr. 29, 2019
Applicant:
TT Electronics Plc, Carrollton, TX (US);
Inventors:
Brent Hans Larson, Dallas, TX (US);
Shivesh Langhanoja, Flower Mound, TX (US);
Assignee:
TT ELECTRONICS PLC, Carrollton, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 1/02 (2006.01); G01L 19/14 (2006.01); G01L 19/00 (2006.01); H05K 1/09 (2006.01); H05K 1/11 (2006.01); H05K 3/28 (2006.01); H05K 3/32 (2006.01); H05K 7/02 (2006.01); H05K 1/16 (2006.01); G01L 13/02 (2006.01);
U.S. Cl.
CPC ...
H05K 1/185 (2013.01); G01L 19/0007 (2013.01); G01L 19/0076 (2013.01); G01L 19/148 (2013.01); H05K 1/0272 (2013.01); H05K 1/09 (2013.01); H05K 1/111 (2013.01); H05K 1/115 (2013.01); H05K 3/28 (2013.01); H05K 3/32 (2013.01); G01L 13/025 (2013.01); H05K 1/16 (2013.01); H05K 1/18 (2013.01); H05K 1/181 (2013.01); H05K 7/02 (2013.01); H05K 2201/037 (2013.01); H05K 2201/10 (2013.01); H05K 2201/10151 (2013.01); H05K 2203/1327 (2013.01); H05K 2203/308 (2013.01);
Abstract
A sensor device includes a printed circuit board (PCB) substrate having a top surface, a bottom surface, a slot between the top and bottom surfaces, and two holes through the top surface and reaching into the slot. The sensor device further includes a sensor chip mounted on the top surface of the PCB substrate and above one of the two holes. The sensor device further includes a molding compound covering the sensor chip and sidewall surfaces and the top surface of the PCB substrate.