The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 10, 2021

Filed:

Feb. 27, 2019
Applicant:

Raytheon Company, Waltham, MA (US);

Inventors:

Jonathan E. Nufio-Molina, Methuen, MA (US);

Thomas V. Sikina, Acton, MA (US);

James E. Benedict, Lowell, MA (US);

Andrew R. Southworth, Lowell, MA (US);

Semira M. Azadzoi, Tewksbury, MA (US);

Assignee:

RAYTHEON COMPANY, Waltham, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/16 (2006.01); H01P 5/16 (2006.01); H01C 7/00 (2006.01); B33Y 80/00 (2015.01);
U.S. Cl.
CPC ...
H05K 1/16 (2013.01); H01C 7/00 (2013.01); H01C 7/006 (2013.01); H01P 5/16 (2013.01); H05K 1/025 (2013.01); H05K 1/0219 (2013.01); H05K 1/0242 (2013.01); H05K 1/0284 (2013.01); B33Y 80/00 (2014.12); H05K 1/167 (2013.01); H05K 2203/0207 (2013.01);
Abstract

A method of manufacturing a power divider circuit includes milling a conductive material disposed upon a first substrate to form a signal trace. The signal trace includes a division from a single trace to two arm traces, with each of the two arm traces having a proximal end electrically connected to the single trace and a distal end electrically connected to each of two secondary traces. The method further includes depositing a resistive ink between the two distal ends to form a resistive electrical connection between the two arm traces, bonding a second substrate to the first substrate to substantially encapsulate the traces between the first substrate and the second substrate, and milling through at least one of the first substrate or the second substrate to provide access to at least one of the traces. A signal divider is further disclosed.


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