The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 10, 2021

Filed:

Sep. 09, 2019
Applicant:

Lg Innotek Co., Ltd., Seoul, KR;

Inventors:

Seung Jin Lee, Seoul, KR;

Hyung Kyu Yoon, Seoul, KR;

Hye Yeong Jung, Seoul, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 1/11 (2006.01); H05K 1/16 (2006.01); H05K 1/18 (2006.01); H05K 3/00 (2006.01); H05K 3/10 (2006.01); H05K 3/30 (2006.01); H05K 3/40 (2006.01); H05K 3/46 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 31/02 (2006.01);
U.S. Cl.
CPC ...
H05K 1/118 (2013.01); H01L 23/4985 (2013.01); H01L 23/49838 (2013.01); H05K 1/189 (2013.01); H05K 2201/032 (2013.01); H05K 2201/0347 (2013.01); H05K 2201/10128 (2013.01);
Abstract

According to an embodiment, a flexible circuit board includes: a first substrate; a second substrate disposed on the first substrate and including an opening; a first conductive pattern part disposed on a bottom surface of the first substrate; a second conductive pattern part disposed on a top surface of the second substrate; a third conductive pattern part disposed between the first substrate and the second substrate; and an upper protective layer partially disposed on the second conductive pattern part and including a first open region, wherein the third conductive pattern part includes: a first inner lead pattern part disposed in the opening of the second substrate; and a first extension pattern part connected to the first inner lead pattern part, the second conductive pattern part includes: a second inner lead pattern part disposed in the first open region of the upper protective layer; and a second extension pattern part connected to the second inner lead pattern part, and a number of first inner lead pattern parts is greater than a number of second inner lead pattern parts.


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