The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 10, 2021

Filed:

Jan. 31, 2019
Applicant:

Korea Electronics Technology Institute, Seongnam-si, KR;

Inventors:

Chuljong Han, Yongin-si, KR;

Minsuk Oh, Seoul, KR;

Eunji Ko, Seongnam-si, KR;

Hongseon Park, Goyang-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/00 (2006.01); H05K 1/05 (2006.01); H05K 3/46 (2006.01); H05K 3/28 (2006.01); H05K 1/02 (2006.01); C03C 17/40 (2006.01);
U.S. Cl.
CPC ...
H05K 1/056 (2013.01); C03C 17/40 (2013.01); H05K 1/028 (2013.01); H05K 3/285 (2013.01); H05K 3/4608 (2013.01); H05K 3/4644 (2013.01); C03C 2217/256 (2013.01); C03C 2218/154 (2013.01); H05K 2201/0145 (2013.01); H05K 2201/0154 (2013.01); H05K 2201/026 (2013.01); Y10T 428/24917 (2015.01);
Abstract

The present disclosure provides a composite conductive substrate exhibiting enhanced properties both in the folding endurance and the electric conductivity and a method of manufacturing the composite conductive substrate. A composite conductive substrate according to an exemplary embodiment of the present disclosure includes: an insulating layer; a metal nanowire structure embedded beneath one surface of the insulating layer; and a metal thin film coupled to the metal nanowire structure. The composite conductive substrate may be fabricated in an order of the insulating film, the metal nanowire structure, and the metal thin film, or vice versa.


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