The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 10, 2021

Filed:

Aug. 21, 2018
Applicant:

The Charles Stark Draper Laboratory, Inc., Cambridge, MA (US);

Inventors:

John R. Burns, IV, Boston, MA (US);

Jesse J. Wheeler, Revere, MA (US);

Andrew Czarnecki, Quincy, MA (US);

Carlos A. Segura, Ipswich, MA (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 3/00 (2006.01); A61N 1/04 (2006.01); A61N 1/05 (2006.01); A61N 1/36 (2006.01); A61N 1/372 (2006.01); H05K 1/03 (2006.01); H05K 3/46 (2006.01); H05K 3/40 (2006.01); H05K 1/16 (2006.01); H05K 1/11 (2006.01); H01Q 1/38 (2006.01); H01Q 1/27 (2006.01);
U.S. Cl.
CPC ...
H05K 1/028 (2013.01); A61N 1/0404 (2013.01); A61N 1/0472 (2013.01); A61N 1/05 (2013.01); A61N 1/3605 (2013.01); A61N 1/36014 (2013.01); A61N 1/37229 (2013.01); H05K 1/0218 (2013.01); H05K 1/0281 (2013.01); H05K 1/0393 (2013.01); H05K 1/11 (2013.01); H05K 1/165 (2013.01); H05K 3/0014 (2013.01); H05K 3/4007 (2013.01); H05K 3/4626 (2013.01); H05K 3/4635 (2013.01); H01Q 1/273 (2013.01); H01Q 1/38 (2013.01); H05K 2201/0133 (2013.01); H05K 2201/0162 (2013.01); H05K 2201/026 (2013.01); H05K 2201/0323 (2013.01); H05K 2201/09018 (2013.01); H05K 2201/09563 (2013.01); H05K 2201/09681 (2013.01); H05K 2201/10098 (2013.01);
Abstract

A multi-layered electronic device including two or more stacked metal conducting layers, a dielectric layer disposed between metal conducting layers, and at least one electrical connection extending between contact pads of metal conducting layers and through a through hole of the dielectric layer is provided. A system including at least one multi-layered electronic device, a satellite coupled to at least one multi-layered electronic device, and a controller hub electrically connected to the multi-layered electronic device via the satellite is also provided. A method of manufacturing the multi-layered electronic device including forming first and second first metal conducting layers, depositing a dielectric layer adjacent to the metal conducting layers, and connecting the metal conducting layers is also provided.


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