The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 10, 2021

Filed:

Dec. 19, 2017
Applicant:

Shindengen Electric Manufacturing Co., Ltd., Tokyo, JP;

Inventors:

Kenichi Suzuki, Saitama, JP;

Wataru Miyazawa, Saitama, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03K 17/16 (2006.01); H01L 25/16 (2006.01); G01R 15/18 (2006.01); H01F 38/28 (2006.01); H01L 29/20 (2006.01);
U.S. Cl.
CPC ...
H03K 17/162 (2013.01); G01R 15/181 (2013.01); H01L 25/16 (2013.01); H01F 38/28 (2013.01); H01L 29/2003 (2013.01);
Abstract

A semiconductor module includes: a semiconductor substrate; a switching element having a first electrode, a second electrode, and a gate electrode, and the switching element configured to perform turning on/off between the first electrode and the second electrode in response to applying of a predetermined gate voltage to the gate electrode; a control circuit part configured to control the gate voltage; and a current detection element configured to detect a current which flows between the first electrode and the second electrode of the switching element, wherein the switching element, the control circuit part, and the current detection element are mounted on the semiconductor substrate, and the current detection element is formed of a Rogowski coil.


Find Patent Forward Citations

Loading…