The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 10, 2021
Filed:
Nov. 26, 2019
Applicants:
Autonetworks Technologies, Ltd., Mie, JP;
Sumitomo Wiring Systems, Ltd., Mie, JP;
Sumitomo Electric Industries, Ltd., Osaka, JP;
Inventors:
Assignees:
AUTONETWORKS TECHNOLOGIES, LTD., Mie, JP;
SUMITOMO WIRING SYSTEMS, LTD., Mie, JP;
SUMITOMO ELECTRIC INDUSTRIES, LTD., Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 15/01 (2006.01); C22C 5/06 (2006.01); H01B 1/02 (2006.01); H01R 13/03 (2006.01); B32B 15/20 (2006.01); C23C 28/02 (2006.01); C23C 30/00 (2006.01); B32B 15/04 (2006.01); C22C 27/00 (2006.01);
U.S. Cl.
CPC ...
H01R 13/03 (2013.01); B32B 15/01 (2013.01); B32B 15/018 (2013.01); B32B 15/04 (2013.01); B32B 15/043 (2013.01); B32B 15/20 (2013.01); C22C 5/06 (2013.01); C22C 27/00 (2013.01); C23C 28/02 (2013.01); C23C 28/021 (2013.01); C23C 28/023 (2013.01); C23C 30/00 (2013.01); C23C 30/005 (2013.01); H01B 1/026 (2013.01); B32B 2457/00 (2013.01); Y10T 428/1291 (2015.01); Y10T 428/12681 (2015.01); Y10T 428/12847 (2015.01); Y10T 428/12854 (2015.01); Y10T 428/12875 (2015.01); Y10T 428/12882 (2015.01); Y10T 428/12896 (2015.01); Y10T 428/12903 (2015.01); Y10T 428/12917 (2015.01); Y10T 428/12931 (2015.01); Y10T 428/12937 (2015.01); Y10T 428/12944 (2015.01); Y10T 428/12951 (2015.01); Y10T 428/12993 (2015.01);
Abstract
A metallic material that includes a base material; and a surface layer formed on a surface of the base material and exposed on an outermost surface, wherein the surface layer contains Ag, and In less than the Ag in atomic ratio, and a connection terminal being made of the metallic material, wherein the surface layer is formed on a surface of the base material, at least in a contact portion electrically contacting an opposite electrically conductive member.