The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 10, 2021

Filed:

Dec. 04, 2019
Applicants:

Semiconductor Manufacturing International (Shanghai) Corporation, Shanghai, CN;

Smic New Technology Research and Development (Shanghai) Corporation, Shanghai, CN;

Inventor:

Yong Li, Shanghai, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/76 (2006.01); H01L 29/66 (2006.01); H01L 21/8234 (2006.01); H01L 23/522 (2006.01); H01L 21/768 (2006.01); H01L 27/088 (2006.01); H01L 21/8238 (2006.01); H01L 23/485 (2006.01); H01L 21/285 (2006.01); H01L 29/78 (2006.01); H01L 27/092 (2006.01); H01L 21/28 (2006.01); H01L 21/283 (2006.01); H01L 21/84 (2006.01); H01L 29/06 (2006.01); H01L 29/417 (2006.01);
U.S. Cl.
CPC ...
H01L 29/66795 (2013.01); H01L 21/283 (2013.01); H01L 21/28008 (2013.01); H01L 21/28512 (2013.01); H01L 21/76814 (2013.01); H01L 21/76877 (2013.01); H01L 21/823431 (2013.01); H01L 21/823475 (2013.01); H01L 21/823814 (2013.01); H01L 21/823821 (2013.01); H01L 21/823857 (2013.01); H01L 21/845 (2013.01); H01L 23/485 (2013.01); H01L 23/5226 (2013.01); H01L 27/0886 (2013.01); H01L 27/0924 (2013.01); H01L 29/0653 (2013.01); H01L 29/41783 (2013.01); H01L 29/66454 (2013.01); H01L 29/66545 (2013.01); H01L 29/785 (2013.01); H01L 29/7848 (2013.01); H01L 21/76825 (2013.01); H01L 21/76828 (2013.01); H01L 21/76831 (2013.01); H01L 29/41791 (2013.01);
Abstract

A semiconductor structure is provided. The semiconductor structure includes a base substrate; and a first doped epitaxial layer and a second doped epitaxial layer in the base substrate. Each of the first and second doped epitaxial layers is corresponding to a different gate structure on the base substrate. The semiconductor structure further includes a repaired dielectric layer formed on and surrounding each of the first and second doped epitaxial layer; a metal layer on the repaired dielectric layer; an interlayer dielectric layer over the base substrate and covering tops of gate structures; and a conductive plug on the metal layer and through the interlayer dielectric layer.


Find Patent Forward Citations

Quick Actions:

Li, Yong. (2021). Semiconductor structure having a repaired dielectric layer (U.S. Patent No. 11088265). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11088265

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…