The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 10, 2021
Filed:
Jan. 10, 2018
Boe Technology Group Co., Ltd., Beijing, CN;
Beijing Boe Display Technology Co., Ltd., Beijing, CN;
Lianjie Qu, Beijing, CN;
Bingqiang Gui, Beijing, CN;
Yonglian Qi, Beijing, CN;
Guangdong Shi, Beijing, CN;
Shuai Liu, Beijing, CN;
Hebin Zhao, Beijing, CN;
BOE TECHNOLOGY GROUP CO., LTD., Beijing, CN;
Beijing BOE Display Technology Co., Ltd., Beijing, CN;
Abstract
The present application discloses a method of fabricating an array substrate. The method includes forming a first conductive material layer on a base substrate; forming an insulating layer on a side of the first conductive material layer distal to the base substrate, the insulating layer formed to cover a first part of the first conductive material layer, exposing a second part of the first conductive material layer; over-etching the first conductive material layer to remove the second part of the first conductive material layer, and remove a portion of a periphery of the first part of the first conductive material layer to form a recess between the insulating layer and the base substrate, thereby forming a first electrode; and subsequent to forming the first electrode and the recess, annealing the insulating layer to mobilize a portion of the insulating layer above the recess and fill the recess with a mobilized insulating material.