The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 10, 2021
Filed:
Aug. 29, 2019
Applicant:
Skyworks Solutions, Inc., Irvine, CA (US);
Inventors:
Assignee:
Skyworks Solutions, Inc., Irvine, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/065 (2006.01); H01L 23/498 (2006.01); H01L 23/66 (2006.01); H03F 3/195 (2006.01); H03F 3/213 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); H01L 23/49816 (2013.01); H01L 23/66 (2013.01); H01L 25/0655 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48145 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06513 (2013.01); H01L 2924/19104 (2013.01); H01L 2924/19105 (2013.01); H03F 3/195 (2013.01); H03F 3/213 (2013.01); H03F 2200/294 (2013.01); H03F 2200/451 (2013.01);
Abstract
A packaged module for use in a wireless communication device has a substrate supporting a crystal and a first die that includes at least a microprocessor and one or more of radio frequency transmitter circuitry and radio frequency receiver circuitry. The first die is disposed between the crystal and the substrate. An overmold encloses the first die and the crystal. The substrate also supports a second die that includes at least a power amplifier for amplifying a radio frequency input signal, where the second die is disposed on an opposite side of the substrate from the first die and the crystal.