The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 10, 2021

Filed:

Aug. 12, 2019
Applicant:

Viasat, Inc., Carlsbad, CA (US);

Inventors:

Steven J. Franson, Scottsdale, AZ (US);

Douglas J. Mathews, Mesa, AZ (US);

Assignee:

VIASAT, INC., Carlsbad, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/66 (2006.01); H01L 21/50 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01); H01Q 1/22 (2006.01); H01Q 1/38 (2006.01); H01L 21/60 (2006.01);
U.S. Cl.
CPC ...
H01L 23/66 (2013.01); H01L 21/50 (2013.01); H01L 23/49816 (2013.01); H01L 23/49822 (2013.01); H01L 23/5383 (2013.01); H01Q 1/2283 (2013.01); H01Q 1/38 (2013.01); H01L 2021/60 (2013.01); H01L 2021/60285 (2013.01); H01L 2223/6616 (2013.01); H01L 2223/6627 (2013.01); H01L 2223/6677 (2013.01);
Abstract

Disclosed is an antenna apparatus including a substrate having a cavity in a first outer surface thereof. The substrate has a sidewall defining a portion of the cavity, and a first edge contact is formed at the sidewall. An IC chip is disposed within the cavity and has a side surface facing the sidewall and a second edge contact formed on the side surface electrically connected to the first edge contact. An antenna element, disposed at a second outer surface of the substrate opposite the first outer surface, is electrically connected to RF circuitry within the IC chip through a conductive via extending within the substrate.


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