The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 10, 2021

Filed:

Apr. 04, 2017
Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventors:

Kazuhiro Maeda, Tokyo, JP;

Takayuki Hisaka, Tokyo, JP;

Hitoshi Kurusu, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/528 (2006.01); H01L 23/31 (2006.01); H01L 23/522 (2006.01); H01L 23/482 (2006.01); H01L 29/417 (2006.01); H01L 29/423 (2006.01); H01L 29/778 (2006.01); H01L 21/768 (2006.01); H01L 21/764 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5283 (2013.01); H01L 23/315 (2013.01); H01L 23/3171 (2013.01); H01L 23/4821 (2013.01); H01L 23/4824 (2013.01); H01L 23/5222 (2013.01); H01L 29/41725 (2013.01); H01L 29/42316 (2013.01); H01L 21/764 (2013.01); H01L 21/768 (2013.01); H01L 23/5221 (2013.01); H01L 29/778 (2013.01);
Abstract

A multi-finger transistor including plural control electrodes (), plural first electrodes (), and plural second electrodes () is provided on a semiconductor substrate (). A resin film () covers the transistor. A first wiring () electrically connecting the plural first electrodes () to one other is provided on the resin film (). The resin film () covers contact portions between the first wiring () and the plural first electrodes (). A first hollow structure () sealed with the resin film () is provided around the plural control electrodes () and the plural second electrodes ().


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