The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 10, 2021

Filed:

Feb. 05, 2019
Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventors:

Joao Carlos Felicio Brito, Murphy, TX (US);

Javier Antonio Valle Mayorga, Frisco, TX (US);

Hector Torres, McKinney, TX (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/367 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3675 (2013.01); H01L 21/486 (2013.01); H01L 21/4853 (2013.01); H01L 23/49811 (2013.01); H01L 23/49827 (2013.01); H01L 23/49833 (2013.01); H01L 24/48 (2013.01); H01L 24/85 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48157 (2013.01);
Abstract

A hermetic ceramic package for high current signals includes a substrate made of a plurality of ceramic green sheets that form an upper body portion having an upper surface and a lower body portion having a lower surface and an intermediate surface between the upper surface and the lower surface. A first conductive plate is formed on the intermediate surface and a first plurality of conductive pad vias are formed in the lower body portion, extending from the first conductive plate to the lower surface of the lower body portion. A heat sink if coupled to the lower surface of the lower body portion and a first conductive pad also coupled to the lower surface such that the first conductive pad is electrically coupled to the first plurality of conductive pad vias.


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