The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 10, 2021
Filed:
Jul. 22, 2015
Applicant:
Mitsubishi Electric Corporation, Chiyoda-ku, JP;
Inventors:
Noboru Miyamoto, Tokyo, JP;
Masao Kikuchi, Tokyo, JP;
Assignee:
Mitsubishi Electric Corporation, Chiyoda-ku, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/10 (2006.01); H01L 23/34 (2006.01); H01L 23/00 (2006.01); H01L 23/36 (2006.01); H01L 29/06 (2006.01);
U.S. Cl.
CPC ...
H01L 23/34 (2013.01); H01L 23/36 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H01L 29/0657 (2013.01); H01L 2224/26175 (2013.01); H01L 2224/27013 (2013.01); H01L 2224/29013 (2013.01); H01L 2224/29014 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/29191 (2013.01); H01L 2224/30051 (2013.01); H01L 2224/30519 (2013.01); H01L 2224/8314 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83194 (2013.01); H01L 2924/10155 (2013.01); H01L 2924/10158 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/181 (2013.01); Y10T 156/10 (2015.01);
Abstract
A semiconductor device includes a semiconductor module having a heat conductive portion formed of metal and also having a molded resin having a surface at which the heat conductive portion is exposed, a cooling body secured to the semiconductor module by means of bonding material, and heat conductive material formed between and thermally coupling the heat conductive portion and the cooling body.