The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 10, 2021

Filed:

Jul. 02, 2018
Applicant:

Hitachi Metals, Ltd., Tokyo, JP;

Inventors:

Hisashi Tanie, Tokyo, JP;

Hiromi Shimazu, Tokyo, JP;

Hiroyuki Ito, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/12 (2006.01); H01L 23/36 (2006.01); H01L 23/00 (2006.01); H01L 23/373 (2006.01); H01L 25/07 (2006.01); H01L 25/18 (2006.01); H01L 25/00 (2006.01); H01L 21/52 (2006.01); H01L 23/538 (2006.01);
U.S. Cl.
CPC ...
H01L 23/12 (2013.01); H01L 21/52 (2013.01); H01L 23/36 (2013.01); H01L 24/29 (2013.01); H01L 24/83 (2013.01); H01L 25/072 (2013.01); H01L 25/18 (2013.01); H01L 25/50 (2013.01); H01L 23/3735 (2013.01); H01L 23/5385 (2013.01); H01L 2224/8384 (2013.01); H01L 2224/83095 (2013.01); H01L 2924/3511 (2013.01);
Abstract

The objective of the present invention is to provide a technique that ensures conduction between a gate terminal of a semiconductor switching element and a wiring layer in a semiconductor device formed with a wiring layer inside a ceramic layer. This semiconductor device comprises: a wiring layer that is inside a ceramic layer formed above an insulation layer; and a metal layer for connecting terminals from the semiconductor switching element other than the gate terminal. The wiring layer and the gate terminal from the semiconductor switching element are connected electrically via a connection part formed from a conductive material. The connection part protrudes more than the metal layer toward the semiconductor switching element.


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